DragonFly IV
Electronic 3D printing, from circuit design to manufacturing, completed in a single print.
DragonFly IV is a multi-material, multi-layer 3D printer that presents a new paradigm in electronic circuit manufacturing.
It can output substrates, conductive circuits, and passive components in a single integrated process, enabling fast and precise electronic component manufacturing without complex manual work.
Key Features
Circuit completed with one output
Unlike traditional PCB manufacturing methods, it integrates multiple processes into one, significantly reducing circuit manufacturing time.
Free 3D design support
Wiring and design are possible in three-dimensional space, not limited to flat surfaces, allowing for the implementation of complex structures.
New Form Factor
Our proprietary FLIGHT software allows you to design and print unprecedented electrical and mechanical composite structures.
Clean and efficient process
We provide an eco-friendly manufacturing environment by not using hazardous chemicals and minimizing energy use.
DragonFly IV Tech Specs and Capabilities
Specifications
| Dimensions | 1,400mm x 800mm x 1,800mm |
| Weight | 520kg (1,150lbs) |
| Power Supply* | 230 VAC, 20A, 50–60Hz |
| Network Connectivity | Ethernet TCP/IP 10/100/1000 |
| Operational Humidity | Above 35% non-condensing |
| Operational Temperature | 18°C (64°F) to 28°C (82°F) |
| Regulatory Compliance | UL, CE, FCC |
| Deposition Technology | Piezo drop-on-demand inkjet |
| Number of Printheads | 2, one for each ink: conductive and dielectric |
| Software | FLIGHT Software Suite (Design, Verification, Pre-Production) |
Capabilities
| Build Volume | 160mm x 160mm x 3mm |
| Inks | Optimized silver nano particles and dielectric inks |
| Supported File Formats | All major ECAD and MCAD Software, ODB++, Gerber & Excellon, STLs |
| Resolution | 18 µm (x), 18 µm (y), 10 µm (z) |
| Min. Line/Space | 75 μm traces/ 150 μm spacing |
| Min. BGA Pitch | 400 μm |
| Min. Via | 200 µm |
| Min. Dielectric Layer Thickness | 10.0 μm |
| Min. Conductive Layer Thickness | 1.18 μm |
| Conductivity (Relative to Copper) | 30% +/-5% |
| Dielectric Constant (Dk) @ 2 GHz/15 GHz | 2.77 / 2.78 |
| Tangential Loss (Df) @ 2 GHz/15 GHz | 0.015 / 0.018 |
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